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CMP/BackGrind Process Engineer 抛光/覆膜工艺工程师

工作经验:不限

最低学历:本科

职位类别:半导体技术

职位月薪:6000-12000元/月 

岗位职责:

1.Responsible to meet process requirements and capability in CMP-wafer polishing and silicon wafer Backgrind processes and tools.
2.Develop, qualify, and sustain MEMS and foundry fabrication processes in manufacturing cleanroom facility
3. Evaluate and improve fabrication processes to improve yield, quality and cost
4.Build and maintain process operation specifications, statistical process control charts, material disposition, FMEA and equipment qualification
5. Support manufacturing operation and activities including fabrication process yield or failure issues and training of manufacturing operators
6.Work with cross functionally other teams of manufacturing, equipment and quality teams

任职要求:

·BS, MS, or PhD in electrical engineering, mechanical engineering, engineering physics, chemical engineering or equivalent
·3 years’ CMP or backgrind process related experience in MEMS or semiconductor industries
·Expertise in process setup, optimize and troubleshooting on CMP and grinder tools
·Strong understanding and hands-on experience on Backend and MEMS fabrication processes with CMP, grinder, laser scriber or dicing equipment.
·Proficient in metrology and inspection tools including SEM, surface profiler, thin film measurement, and microscopes
·Knowledge and experience of process design of experiments, statistical process control and computer software like excel, word, power point, data analysis and manufacturing systems
·Ability to work in a clean room environment for large amounts of time
·Excellent oral and written communications skills as well as presentation skills
·Strong team work with equipment, maintenance and manufacturing team members

工作地址:

辽宁省抚顺市经济开发区沈东7路78号

应聘邮箱:hke_hr@hanking.com